| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0284 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J5-20 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J5-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01J1-02 |
| filingDate |
2011-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b7c92f216b4c6488195e04e377be6c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f88bd54d4d180e8d359dcb8a97ecc96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3c7a1ed46eb20c66ea714f02745f9eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a28651a7b6a6f27f375ba1fe087dc285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa86b03764a2f91cc37e2909659231c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11d028c88c27a177a47db34f293ab265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4178e3e58ceed31cad399a9a41887bec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44c63ceb35b3f4df1bed6dbe62684619 |
| publicationDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012063359-A |
| titleOfInvention |
Infrared sensor unit |
| abstract |
An infrared sensor unit having excellent heat insulation performance and capable of being reduced in size is provided. An infrared sensor unit in which a thermal infrared sensor and a corresponding semiconductor device are formed on a common semiconductor substrate. An insulating upper layer is coated on the semiconductor substrate to cover the semiconductor device formed on the surface layer portion of the semiconductor substrate. The thermal sensor is mounted on a sensor pedestal supported above the semiconductor device by a heat insulating support, and the sensor pedestal and the heat insulating supporting member are formed of a porous material laminated on an insulating upper layer. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11320313-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10634561-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210041944-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10605667-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102304320-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10281333-B2 |
| priorityDate |
2005-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |