| abstract |
An electronic component device manufacturing method capable of easily overmolding and underfilling without requiring a jig for preventing leakage of a molten resin composition, and an electronic component sealing resin composition sheet used therefor provide. In accordance with an electronic component mounting area on a mounting substrate, a sheet B having a viscosity of 20 to 250 Pa · s at a molding temperature that is slightly smaller than or slightly larger than the area is stacked, and further, the area is And a sheet A having a viscosity at the molding temperature of 2000 to 50000 Pa · s is stacked and then heated to the molding temperature in a vacuum chamber, and the sheet A covers the sheet B and the electronic component. After that, the pressure in the chamber is released, and underfill of the electronic component by the melt of the sheet B is performed in a sealed space formed between the sheet A and the mounting substrate. . [Selection figure] None |