| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83203 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2011-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87435cfc3e451209a29f142f54b9865 |
| publicationDate |
2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012041540-A |
| titleOfInvention |
Circuit connection material, connection method using the same, and connection structure |
| abstract |
[PROBLEMS] To improve the adhesion with an interface with a silicon nitride film and exhibit excellent connection reliability while suppressing fluctuations in resistance value between circuit electrodes when subjected to high temperature and high humidity treatment. A simple circuit connection material is provided. A circuit connecting material interposed between a pair of circuit members arranged so that circuit electrodes face each other and electrically and mechanically connecting the facing circuit members, (1) A polyfunctional (meth) acrylate monomer, (2) a curing agent that generates free radicals by heat or light, and (3) an ethylenically unsaturated group in the side chain, and the double bond equivalent is 1000 to 12000. A circuit connecting material containing a reactive acrylic polymer is provided. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105683323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015133386-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018058924-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016272854-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015133386-A1 |
| priorityDate |
2011-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |