| abstract |
A semiconductor device capable of controlling the dimension of a sidewall of a connection hole of an insulating film with high accuracy and at low cost. A semiconductor device includes an insulating film that covers a main surface of a substrate and has a connection hole reaching an upper surface of a lower electrode. The film density of the insulating film 12 decreases with increasing distance from the main surface of the base material 10 in the thickness direction of the insulating film 12. The inner diameter of the connection hole 12h increases as the film density of the insulating film 12 decreases. [Selection] Figure 3 |