| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2011-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_903f1fad8cfee0cbae0a68db7d95cf3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8fd3fea317f7429da9913ccd22077d5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3180b6a0c6324ae1b0a02b8e8a740b78 |
| publicationDate |
2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012033889-A |
| titleOfInvention |
Wafer processing tape and semiconductor processing method using the same |
| abstract |
A wafer processing tape capable of sufficiently suppressing re-adhesion between semiconductor chips during pick-up and a semiconductor processing method using the same. A thermosetting adhesive layer 13 containing a compound having an epoxy group is laminated on the adhesive layer 12b of a dicing tape 12 as an adhesive tape comprising a support substrate 12a and an adhesive layer 12b. In the dicing die bonding tape 10 as a wafer processing tape, the support base 12a is made of ethylene- (meth) acrylic acid binary copolymer or ethylene- (meth) acrylic acid- (meth) acrylic acid alkyl ester ternary. The copolymer is made of an ionomer resin crosslinked with metal ions, the weight fraction of the (meth) acrylic acid component in the copolymer is 1% or more and less than 10%, and the (meth) acrylic in the ionomer resin The neutralization degree of the acid is 50% or more. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10699933-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016148024-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016011427-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017186444-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016171261-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9595446-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017118119-A |
| priorityDate |
2010-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |