http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012025906-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a74ff03001b234896dc3c0ac4778416 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2010-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26ba99b9c8657947799a26083a56fedc |
| publicationDate | 2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012025906-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract | An epoxy resin composition capable of lowering melt viscosity in consideration of wire sweepability even when highly filled with an inorganic filler and a semiconductor device using the same are provided. In an epoxy resin composition for semiconductor encapsulation having an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components, the following formula is used as a side chain at a specific position of polypropylene glycol. And polyricinoleate having a hydroxyl group or a hydroxyl group. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7302496-B2 |
| priorityDate | 2010-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.