| abstract |
A material suitable for sealing an LED element and a gas barrier layer of a resin member is provided, and an LED device, an FPD device, a semiconductor device, and the like using the material are provided. A component (A) is represented by the following general formula (1), a component (B) is a siloxane compound having a structure in which hydrogen is directly bonded to silicon, and a component (C) is a group 1 of the periodic table. A polymer composition obtained by mixing and reacting an organometallic compound of Group 2 or 12 to 14 metal and a metal catalyst of Group 8 to 10 of the periodic table as component (D). [Selection figure] None |