http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012007094-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_132721b781afede2175d04e894580568 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C47-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-12 |
| filingDate | 2010-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_137b7307df6c1bae82302e40634f1aff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bff27d1aec0a09bb3787e9b1fb933d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9686452be18d0bb97a37e96e8e2bcce3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6ed602dfcb173783e60d9d9d7b1a54f |
| publicationDate | 2012-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012007094-A |
| titleOfInvention | Thermoplastic resin extrusion foam insulation board |
| abstract | PROBLEM TO BE SOLVED: To provide a thermoplastic resin extruded foam heat insulating plate having a low thermal conductivity and excellent heat insulating property over a long period of time. The present invention relates to a polystyrene resin described in JIS K7122 (1987) "when heat of fusion is measured after a certain heat treatment" (the heating rate and cooling rate in adjusting the condition of the test piece are The endothermic peak calorific value associated with the melting of the polyester resin based on the DSC curve obtained at a heating rate of 10 ° C./min using a heat flux differential scanning calorimeter is adopted. A physical foaming agent having a high permeation rate with respect to polystyrene resin was used as a base resin of a mixture containing a relatively large amount of an amorphous or low crystalline polyester resin that was less than 5 J / g (including 0). Thermoplastic resin extrusion insulation board, excellent production stability during extrusion foaming, good appearance with no irregularities on the foam surface, sufficient thickness, expansion ratio and closed cell High thermal conductivity, low thermal conductivity and excellent heat insulation over a long period of time, particularly excellent radiation heat insulation and heat resistance. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012255078-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014077123-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019189666-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018203884-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7041578-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016138291-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170007325-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10017618-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5892300-B2 |
| priorityDate | 2010-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.