| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2009-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011523778-A |
| titleOfInvention |
Electrical component assembly |
| abstract |
The present invention relates to an electrical component assembly having a semiconductor component 1 mounted on a varistor body 2. The varistor body is contact-connected to the semiconductor component so as to protect the semiconductor component from electrostatic discharge, has a varistor ceramic as a substrate, and has a high thermal conductivity material different from the varistor ceramic as a filler. Contains materials. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9978912-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017524261-A |
| priorityDate |
2008-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |