http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011521033-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2009-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011521033-A |
| titleOfInvention | Electronic packaging |
| abstract | (A) General formula (1) (wherein R 1 to R 9 are each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group, Or a halogen atom), (B) a polyfunctional epoxy compound having two or more functional groups, and (C) an epoxy curing agent containing a phenolic hydroxyl group, the ratio of the epoxy compound (A) being The epoxy resin composition is 1 to 99% by mass based on the total mass of the epoxy compounds (A) and (B), surface-modified with hexamethyldisilazane (HMDS), and structurally modified with a ball mill. An epoxy resin composition containing pyrogenic silica is also provided. |
| priorityDate | 2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 198.