| abstract |
The present invention relates to a heat sink for an electric device or an electronic device, an E & E device including a heat source and a heat sink, and a method for manufacturing the heat sink. Thermally conductive plastic comprising expanded graphite in an amount of at least 20% by weight, based on the total weight of the thermally conductive plastic material, and / or having an in-plane thermal conductivity Λ // of at least 7.5 W / m · K Includes plastic body made of material. The heat sink of the present invention can be manufactured from a thermally conductive plastic material by injection molding a thermally conductive plastic material and optionally then applying a coating layer. In an E & E device, the heat sinks of the present invention are combined with each other so as to be in thermal communication with the heat source. |