http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011252042-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-20
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filingDate 2010-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b694fea124739e2eb56ebc514d8e24d6
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publicationDate 2011-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011252042-A
titleOfInvention Manufacturing method of epoxy resin molding material for semiconductor encapsulation and resin-encapsulated semiconductor device
abstract Semiconductor encapsulation that prevents metal contamination during manufacturing by reducing the metal concentration, and that does not impair the reliability of the device when semiconductor encapsulation is carried out, does not substantially contain foreign metal. A method for producing an epoxy resin molding material is provided. SOLUTION: All raw materials including an epoxy resin that is solid at room temperature, a phenol resin that is solid at room temperature, and an inorganic filler are mixed with a solvent to form a liquid mixture, and the mixture is passed through a magnet filter for liquid to remove metal components. The manufacturing method of the epoxy resin molding material for semiconductor sealing which removes the said solvent from the mixture which removed the metal component. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021205892-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230128479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020158635-A
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Total number of triples: 28.