http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011247996-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 |
| filingDate | 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18ac39e9ef9412b3f8cc5760c7f050ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6809d2278a9d7b9ccf38705ae1f339d5 |
| publicationDate | 2011-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011247996-A |
| titleOfInvention | Novel photosensitive resin composition and use thereof |
| abstract | The subject of the present invention is excellent in fine workability, developability, low temperature curability, flexibility of cured film, electrical insulation reliability, solder heat resistance, organic solvent resistance, flame resistance, etc. An object of the present invention is to provide a photosensitive resin composition in which warpage of a substrate is small. A photosensitive resin composition comprising at least (A) a carboxyl group-containing resin, (B) a photosensitive resin, (C) a thermosetting resin, (D) a photopolymerization initiator, and (E) a phosphorus-containing flame retardant. When the 5% weight reduction temperature of the cured film obtained from the photosensitive resin composition other than the flame retardant excluding the (E) phosphorus-containing flame retardant component from the entire photosensitive resin composition is used as the reference temperature The (E) phosphorus-containing flame retardant is at least (E1) a phosphorus-containing flame retardant having a 5% weight reduction temperature not lower than a reference temperature and lower than a reference temperature + 100 ° C. and (E2) a 5% weight reduction temperature is a reference temperature + 100 ° C. As mentioned above, the said subject can be solved by using the photosensitive resin composition containing the phosphorus containing flame retardant which is less than reference temperature +200 degreeC. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018119157-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016000782-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020105447-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7265864-B2 |
| priorityDate | 2010-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 387.