| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a74ff03001b234896dc3c0ac4778416 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2050-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H2001-0042 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H50-005 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H50-10 |
| filingDate |
2010-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8532e5964cb836ac0cb6911b3b8e524f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_555203390d8394c839df41c1a85ce511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78af9241037d8faf161535f30662dad9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217a1303cfa60d2038edea082f40ae49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11080218b81b311c7239f2c40e3d056e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c30d9e1bc476b75771a38e56ded4d54a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_355f3f632db71f01e5879d78dccd6795
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0a90e9ee996d478b79534fe0764e126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91db01594f7df6c0e3c8b3a345e00d63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7a028ee279e10649097c410361c06a0 |
| publicationDate |
2011-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011243363-A |
| titleOfInvention |
Structure having wiring structure and MEMS relay |
| abstract |
Provided are a structure and a MEMS relay having a wiring structure capable of reducing transmission loss while suppressing an increase in the planar size of the structure and easily forming a ground conductor surrounding a signal line. . A ground conductor is formed on the base substrate and first ground wirings formed on both sides in the width direction of a signal line on one surface side of the base substrate. The second ground wirings 52, 52 made of vias electrically connected to the ground wirings 51, 51 and the second ground wirings 52, 52 on the other surface side of the base substrate 1 are electrically connected to each other to form a signal line. 13 is formed on both sides of the cavity portion 27 in the intermediate substrate 2, the third ground wiring 53 parallel to 13, the fourth ground wiring 54 formed on the cover substrate 3 facing the base substrate 1. The first ground wirings 51 and 51 and the fourth ground wiring 54 have fifth ground wirings 55 and 55 made of through slit wirings. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018527205-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9153510-B2 |
| priorityDate |
2010-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |