| abstract |
The present invention provides a bonding method for bonding members together using a bonding film that can be bonded firmly with high dimensional accuracy and efficiently in a short time. A bonding method includes forming a bonding film 3 including an Si skeleton having an atomic structure including a siloxane bond and a leaving group bonded to the Si skeleton and including an organic group on the substrate by plasma polymerization. The bonding film and the counter substrate are in close contact with each other, the step of obtaining the base material 1 with the bonding film, the step of expressing the adhesiveness with the counter substrate 2 on the surface of the bonding film by applying energy to the bonding film, and Thus, the process of obtaining a temporary joined body by bonding together the base material with a bonding film and the counter substrate, and the temperature of the atmosphere when applying the temporary joined body to the bonding film in the second step And a step of improving the bonding strength of the bonding film to obtain a bonded body by heating at a higher temperature. [Selection] Figure 1 |