http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011233622-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2010-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84e1e32480ebbc3fa771ca8105d6b23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78663d996f61ad5dfecd2e9821f6e9aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9844608125bdf65b9c1d103c931feaa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9f443032f7998c8e92c7d2f72a0c0ae |
| publicationDate | 2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011233622-A |
| titleOfInvention | Flexible printed wiring board, optoelectric wiring board and manufacturing method thereof |
| abstract | The present invention provides a flexible printed wiring board, a photoelectric wiring board, and a manufacturing method thereof, in which an optical waveguide laminated on a flexible printed wiring board on which a copper circuit is formed does not crack even if the optical waveguide is bent. In a flexible printed wiring board in which a copper circuit is formed on a flexible substrate, the copper circuit material is a rolled copper foil, and the elastic modulus of the copper circuit material is 1.2 times or less that of the flexible substrate. A flexible printed wiring board characterized by: an opto-electric wiring board formed by laminating an optical waveguide on the flexible printed wiring board; and a flexible printed wiring board comprising a rolled copper foil laminated on a flexible base material to form a copper circuit. It is a manufacturing method, Comprising: It is a manufacturing method of the flexible printed wiring board which has the process which heat-processes a rolled copper foil to 250-350 degreeC, and makes the elasticity modulus 4000-6000 Mpa. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7338621-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019216425-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019216425-A1 |
| priorityDate | 2010-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.