http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011228585-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
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filingDate 2010-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1efa973a45bea2b0451e01f57f64a8c7
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publicationDate 2011-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011228585-A
titleOfInvention Heat dissipation structure
abstract To achieve high heat dissipation performance without significantly changing the outer dimensions (appearance) of a heat dissipation structure. A heat dissipating structure including a heat conductive layer (1) and an inner skin layer (2) provided on the innermost side and having a three-dimensional shape shaping layer on the innermost surface side. The thermal conductivity in at least one direction is 2 W / m ยท K or more, the average thickness is 0.2 to 5 mm, and the product of the thermal conductivity and the average thickness is 0.01 W / K or more. The layer has a plurality of irregularities in an area of 10% or more of the endothelial layer, an average valley width of 1 to 20 mm, an average peak width of 0.5 to 5 mm, an average height of 1 to 10 times the average valley width, In addition, heat dissipation is arranged so as to be in contact with at least a part of the heating element, and the surface area of the region provided with the three-dimensional shape shaping layer is 1.2 times or more compared to a flat surface without uneven portions. Structure. [Selection] Figure 1
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