abstract |
A photosensitive resin composition that is easy to form a silica-based coating as an interlayer insulating film, has excellent storage stability, is relatively inexpensive, and has excellent heat resistance, crack resistance, resolution, and transparency, and uses the same A method for forming a silica-based coating, a semiconductor device including the silica-based coating, a flat display device, and an electronic device member. A first siloxane resin obtained by hydrolytic condensation of a first silane compound containing a compound represented by the following general formula (1) and a compound represented by the following general formula (2): A siloxane resin having a weight average molecular weight of 8000 to 300,000 obtained by mixing a second siloxane resin obtained by hydrolytic condensation of the second silane compound and further hydrolytic condensation, a solvent, and naphthoquinone diazide sulfone. A photosensitive resin composition containing an acid ester. [Selection] Figure 3 |