| abstract |
An electronic device for bonding a heat-generating component in an electronic device to a heat-dissipating component such as a heat sink or a heat-dissipating plate because it has excellent thermal conductivity, insulation, and reflow resistance, and excellent adhesion to an adherend. To provide an adhesive sheet. An adhesive composition for electronic equipment comprising (a) a thermoplastic resin, (b) an epoxy resin, (c) a curing agent, (d) boron nitride particles and (e) inorganic spherical particles, (E) An adhesive composition for electronic equipment, wherein the primary average particle diameter of inorganic spherical particles is 10 volume% or less of the primary particle diameter distribution on the volume basis of (d) boron nitride particles. [Selection figure] None |