http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011225642-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
| filingDate | 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2011-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011225642-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | [PROBLEMS] To maintain fluidity even during long-term storage at room temperature, to have good fluidity, curability, and continuous moldability during sealing molding, and to have low moisture absorption, low stress, and metal-based members. To provide an epoxy resin composition for semiconductor encapsulation having an excellent balance of adhesion and having good solder resistance without causing peeling or cracking. (A) An epoxy resin containing an epoxy resin (a1) represented by the general formula (1) and / or an epoxy resin (a2) represented by the general formula (2), (B) the general formula (3) ) Phenol resin curing agent (b1) and phenol resin curing agent (b2) represented by general formula (4), (C) inorganic filler, (D) phosphonium A curing accelerator containing an adduct (d2) of a thiocyanate (d1) and a phosphine compound and a quinone compound, and the content of the inorganic filler (C) is 88% by mass or more in the total epoxy resin composition, 92 It is characterized by being not more than mass%. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015001998-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016197995-A |
| priorityDate | 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.