| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44b2ac87aeadb161b83426d9cf6c4bdc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-84 |
| filingDate |
2010-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_832b8dc5f432a4cbb16672f5af619f32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94b2b87a4ed5e97086f72fb96e55c3fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0b54690d5ad77773dd5210850a4c625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_733ad56b421e0acf0cf749e56b2bcf99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6212899633171370638d6c0f2b2533e |
| publicationDate |
2011-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011222913-A |
| titleOfInvention |
Electrochemical device and circuit board |
| abstract |
PROBLEM TO BE SOLVED: To provide an electrochemical device and a circuit board capable of improving the fixing strength between an electrode pad and a lead. [Solution] The lead 3 of the electrochemical device includes a lead main body 3A containing Al and a bent metal thin film 3a provided at the tip of the lead main body 3A. The metal thin film 3a is a thin film main body 3a1 containing Ni. And a plated layer 3a2 containing Sn and covering at least the outer surface of the folded thin film body 3a1. The specific region on the inner surface of the folded thin film main body 3a1 and the lower surface of the lead main body 3A are directly contacted and welded in the predetermined region R3L without the plating layer 3a2. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10608215-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017183227-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017183227-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016534540-A |
| priorityDate |
2010-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |