| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1aee874d26c72e52dfccc1edb70b7cd8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 |
| filingDate |
2010-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2b22cd945e3e29f1b7788d75865c43b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22956f94c1eb0132efe48adc782136a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93758c8d459ac736d141e118de180ad8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1f8c567b40013178c1a9e7bb527ec31 |
| publicationDate |
2011-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011211137-A |
| titleOfInvention |
Semiconductor device and manufacturing method thereof, electronic device and manufacturing method thereof |
| abstract |
Kind Code: A1 The junction reliability of a fine junction of a semiconductor device and an electronic device is drastically improved. A chip, a wafer, an interposer (wiring board), or any minute narrow pitch exposed on a mounting board that is covered with a heat-resistant organic insulating protective film except for electrode pads or leads to be soldered. A first process of dispersing at least one tin or solder particle on the cleaned metal surface of the electrode pad or lead and bonding the particle to the pad or lead metal surface; and the pad or lead A solution containing 1 to 95% by mass of an organic compound having a metal surface dissolved in an oil-based solvent having a liquid temperature of 180 to 300 ° C. and stable in molecular structure and having at least a carboxyl group (—COOH), and then having an oxygen concentration of 5 ppm or less Bump or solder skin through a second process in which a molten solder solution having a low oxygen concentration is brought into contact with the organic compound solution again. To form. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013157064-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9686871-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9149883-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9289841-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111115555-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013153674-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103492112-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103459075-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I554648-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103492112-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5079169-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103459075-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5079170-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111115555-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I581882-B |
| priorityDate |
2010-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |