| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8aa118fbfa85a6e0cc8c13a8afca19ab |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate |
2010-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38e79cac6ca3e7b5b9bc143b86de3118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f10460a655735893969038b042cfee4 |
| publicationDate |
2011-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011204718-A |
| titleOfInvention |
Semiconductor light emitting device sealing material and method for manufacturing semiconductor light emitting device using the same |
| abstract |
Disclosed is a semiconductor light emitting device sealing material containing glass powder, inorganic phosphor powder and a solvent, and capable of producing a semiconductor light emitting device device having excellent light emission intensity. A semiconductor light emitting device sealing material comprising glass powder, inorganic phosphor powder and a solvent, wherein the solvent has a viscosity of 500 mPa · s or more and a boiling point of 250 ° C. or less. Stop material. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013254839-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020096022-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9441155-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015133735-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015087812-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014162893-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102502476-B1 |
| priorityDate |
2010-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |