http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011195778-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6542bb7a0e2a09022a466ede6627fdff |
| publicationDate | 2011-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011195778-A |
| titleOfInvention | Polymerization curing agent and method for producing the same, resin composition, adhesive for semiconductor, and semiconductor device |
| abstract | A polymerized curing agent capable of improving the degree of freedom of material selection and capable of suppressing generation of voids in the manufacture of a semiconductor device that requires a high-temperature heating process, and a method for manufacturing the same, A resin composition, a semiconductor adhesive, and a semiconductor device are provided. The polymerized curing agent of the present invention is obtained by the reaction of (A) an epoxy resin and (B) a curing agent, and the amount of thermal weight loss of the polymerized curing agent of the present invention is (A) epoxy. It is 10% or less at a temperature at which the thermal weight loss of at least one of the resin or (B) curing agent is greater than 10%. In the method for producing a polymeric curing agent of the present invention, the thermal weight reduction amount of the polymeric curing agent is such that the thermal weight reduction amount of at least one of (A) the epoxy resin or (B) curing agent is greater than 10%. (A) The epoxy resin and (B) the curing agent are reacted so that the temperature is 10% or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014136761-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013145840-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6596611-B1 |
| priorityDate | 2010-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.