| abstract |
The present invention provides a light emitting element and a light emitting element package having a new structure and improved reliability. A light emitting device according to the present invention includes a light emitting structure including a first semiconductor layer, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer, and at least a first semiconductor layer. A bonding layer disposed on the upper surface; a first electrode extending from the upper surface of the first semiconductor layer to the upper surface of the bonding layer; and a second electrode disposed on the second semiconductor layer. [Selection] Figure 1 |