Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-60 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D233-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate |
2011-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fc74b5d8dbcafb9728c1b894dbae322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7a9fa531cccd690d972c181d759155e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c250d87d2becbb1b6d72df8d215b0352 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a0b35579dc6094479493a7fc7bd5ba7 |
publicationDate |
2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2011190260-A |
titleOfInvention |
Plating bath and method |
abstract |
A copper electroplating bath and plating method comprising a copper ion source, an electrolyte and a smoothing agent having a smooth surface on a substrate such as a printed circuit board. A copper plating bath containing a leveling agent that is a reaction product of a specific imidazole compound and a specific epoxide-containing compound. The amount of leveling agent used in the metal electroplating bath is 0.25 to 5000 ppm. Contacting the copper in the copper electroplating bath with the substrate to be plated; and applying a current density for a time sufficient to deposit a copper layer on the substrate. accumulate. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011207878-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019023352-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017222925-A |
priorityDate |
2010-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |