http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011177774-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2010-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d04ffdea465072ec789b8d136ba7e199 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f84bd264c713a5fd9fcbc7688f4b04a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9aa80033fa7e500f918141994cb1ea5 |
| publicationDate | 2011-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011177774-A |
| titleOfInvention | Soldering flux and solder paste composition using the same |
| abstract | Provided are a soldering flux capable of suppressing the occurrence of voids in a solder metal, and suppressing the scattering of flux and solder metal, and a solder paste composition using the same. That is. A soldering flux containing an acid-modified polyolefin. The soldering flux further includes a base resin and an activator, the base resin being rosin or a synthetic resin, and further containing an acid-modified polyolefin. A solder paste composition containing the soldering flux and a solder alloy powder. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180134326-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016010817-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101986264-B1 |
| priorityDate | 2010-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.