http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011171553-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
filingDate | 2010-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2776701f1d85155bdfb28c9dd9afe869 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_277206121544d2a6d71d6d326dfc8a2e |
publicationDate | 2011-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2011171553-A |
titleOfInvention | Manufacturing method of conductive connecting material, connecting method between terminals, forming method of connecting terminal, semiconductor device and electronic apparatus |
abstract | An object of the present invention is to provide a resin composition layer containing a resin component and a metal layer that make it possible to obtain good electrical connection between opposing connection terminals and high insulation reliability between adjacent terminals. It is another object of the present invention to provide a method for producing a conductive connection material having a laminated structure, a connection method between terminals using the conductive connection material produced by the production method, and a method for forming a connection terminal. The above-described problems can be solved by forming a metal layer on at least one surface of a resin composition layer containing a resin component by a vacuum sputtering method or a vacuum deposition method. [Selection] Figure 3 |
priorityDate | 2010-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 208.