http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011169976-A

Outgoing Links

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filingDate 2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c21b2e24a16528e0370f62937ffa6f03
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publicationDate 2011-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011169976-A
titleOfInvention Radiation-sensitive resin composition, interlayer insulating film and method for forming the same
abstract Disclosed is a radiation-sensitive resin composition that can be baked by heating at a low temperature and in a short time and that is suitably used for forming an interlayer insulating film of a flexible display and has high radiation sensitivity. . The present invention relates to a copolymer obtained by copolymerizing [A] (a1) an unsaturated carboxylic acid and / or unsaturated carboxylic acid anhydride, and (a2) an epoxy group-containing unsaturated compound. A radiation-sensitive resin composition for forming an interlayer insulating film comprising a polymer alkali-soluble resin, [B] 1,2-quinonediazide compound, and [C] a compound having two or more mercapto groups in one molecule. is there. The compound having two or more mercapto groups in one molecule of the component [C] is preferably a compound represented by the following formula (1). [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014142163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014142163-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015176124-A
priorityDate 2009-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007131658-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007017959-A
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Total number of triples: 31.