| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2011-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b60a7bbd8a53df9b805291155fe4437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b03303a847852712431db578a948b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7df8c5097f579e6e3836569d58c0af1 |
| publicationDate |
2011-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011166159-A |
| titleOfInvention |
Thermosetting die bond film |
| abstract |
PROBLEM TO BE SOLVED: To suppress the generation of microvoids and local sink marks at the peripheral edge when die-bonding a semiconductor element on an adherend, and as a result, thermosetting capable of improving the manufacturing yield of a semiconductor device. A die-bonded film is provided. When the total weight of the epoxy resin and the phenol resin is X and the weight of the acrylic copolymer is Y, the ratio X / Y is 1 The melt viscosity at 120 to 130 ° C. is in the range of 500 to 3500 Pa · s, and the acrylic copolymer comprises 10 to 60% by weight of butyl acrylate and 40 to 90% by weight of ethyl acrylate. And a thermosetting die-bonding film containing 70 / 3.9 parts by weight or more and 80 parts by weight or less of filler with respect to 100 parts by weight of the total of epoxy resin, phenol resin, and acrylic copolymer. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013157567-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013157567-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015192142-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114929825-A |
| priorityDate |
2008-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |