| abstract |
The entire linear thermal expansion coefficient of the photosensitive resin layer can be kept as low as possible, the resolution is not deteriorated, the adhesiveness between the photosensitive resin layer and the substrate is excellent, and peeling occurs at the time of PCT or a cooling cycle. Provided are a laminated structure that does not occur, in particular, a laminated structure such as a printed wiring board, and a photosensitive dry film used as a solder resist or an interlayer resin insulating layer thereof. In the laminated structure having at least a substrate (1) and a photosensitive resin layer or a cured film layer (2) containing an inorganic filler (3) formed on the substrate, the photosensitive resin layer is provided. Alternatively, the content of the inorganic filler in the cured coating layer is low on the side in contact with the substrate and high on the surface side far from the substrate. Preferably, the content ratio of the inorganic filler in the photosensitive resin layer or the cured film layer is continuously inclined from the side in contact with the substrate toward the surface side far from the substrate or gradually increases stepwise. ing. [Selection] Figure 1 |