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filingDate 2010-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011148981-A
titleOfInvention Silicone resin composition and cured product thereof
abstract 【Task】 Provided is a silicone resin composition that cures in a short time and gives a cured product having excellent adhesion strength to a solder resist, a copper substrate, and the like. [Solution] Silicone resin composition comprising: (A) organopolysiloxane containing at least two alkenyl groups in one molecule (B) organohydrogenpoly containing at least two hydrogen atoms bonded to silicon atoms in one molecule An amount in which the total moles of hydrogen atoms bonded to silicon atoms in the component (B) are 0.1 to 4.0 (molar ratio) relative to the total moles of alkenyl groups in the component (A) of siloxane (C) Platinum group Catalyst amount of metal catalyst (D) Silicone fine particles having an average particle size of 0.1 to 100 μm 30 to 80 parts by mass (E) (meth) acrylate compound with respect to 100 parts by mass in total of component (A) and component (B) 0.01 to 10 parts by mass with respect to 100 parts by mass in total of component (A) and component (B) [Selection] None
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018150446-A
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