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filingDate 2011-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011132540-A
titleOfInvention Laminate, metal foil-clad laminate, printed wiring board, circuit board, LED backlight unit, LED lighting device, and method for producing laminate
abstract A laminated board with high heat dissipation is provided. A nonwoven fabric layer 1 containing a thermosetting resin composition is provided. The thermosetting resin composition contains 80 to 400 parts by volume of an inorganic filler with respect to 100 parts by volume of the thermosetting resin. The inorganic filler is (A) gibbsite-type aluminum hydroxide particles having an average particle diameter (D 50 ) of 2 to 15 μm. (B) Boehmite particles having an average particle size (D 50 ) of 1.5 to 15 μm and crystal water having an average particle size (D 50 ) of 1.5 to 15 μm and a freezing start temperature of 400 ° C. or higher. At least one inorganic component selected from the group consisting of inorganic particles containing or not containing crystal water. (C) A fine particle component composed of aluminum oxide particles having an average particle diameter (D 50 ) of 1.5 μm or less. The mixing ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A), the inorganic component (B), and the fine particle component (C) is 1: 0.1 to 3: 0.1 to 3. [Selection] Figure 1
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