| abstract |
To provide a conductive pattern forming ink capable of forming a highly reliable conductor pattern and excellent in droplet ejection stability, to provide a highly reliable conductor pattern, and such To provide a highly reliable wiring board with a conductive pattern. The conductive pattern forming ink of the present invention is a conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method, and includes metal particles, ceramic particles, and the metal particles. And an aqueous dispersion medium in which the ceramic particles are dispersed. [Selection] Figure 1 |