| abstract |
In a semiconductor chip and a semiconductor device including the semiconductor chip, a flux residue is prevented from remaining around a side portion of a bump. A semiconductor device includes a semiconductor chip and a mounting substrate. A sealing resin 7 is filled between the mounting substrate 8 and the semiconductor chip. The semiconductor chip includes a substrate 1, an electrode pad 2, a first protective film 3 having a first opening 3 o, an under barrier metal film 5, and bumps 6. The first protective film 3 includes a substrate portion 3A formed on the upper surface of the substrate 1, and a pad portion 3B formed on the side surface of the electrode pad 2 and the peripheral portion on the upper surface of the electrode pad 2. The side portion 5p in contact with the first protective film 3 in the under barrier metal film 5 and the side portion 6p in contact with the under barrier metal film 5 in the bump 6 are the outer surface S3B of the pad portion 3B in the first protective film 3. Located on the top. [Selection] Figure 1 |