http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011126999-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
filingDate 2009-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8110d0056c6731e5503f63870307c827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa80348120cc68d073dfb917e4974b51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5456ed96401d97be6950960c0c47371
publicationDate 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011126999-A
titleOfInvention HEAT-RESISTANT RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE USING THE SAME
abstract [PROBLEMS] To provide a heat-resistant resin composition that does not contain a substance that adversely affects the environment, has excellent heat resistance, has excellent curing characteristics, and has significantly improved cracks and voids in cured products compared to conventional products. An article, a method for producing the article, and a molded article using the article. SOLUTION: (A) a specific bismaleimide compound, (B) an aminophenol having an amino group and a phenolic hydroxyl group in one molecule, and (C) an epoxy resin as essential components, and a volatile component content. It is a heat resistant resin composition characterized by being less than 0.3 mass%, its manufacturing method, and a molded article using the same. [Selection figure] None
priorityDate 2009-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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