| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32257 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-38 |
| filingDate |
2009-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65f39b6578735b7cc9dad03b458d4a3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55376e1837da0b73561c2a0779c62c21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03a6f074a14a7755f42175687c6ce2ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df899713455e8af99dc2d2b739499fc8 |
| publicationDate |
2011-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011105778-A |
| titleOfInvention |
Composition for sealing optical semiconductor and light emitting device |
| abstract |
An optical semiconductor sealing resin composition having high gas barrier performance and excellent adhesion to a housing resin or an electrode metal material, and a light emitting device sealed with the composition are provided. SOLUTION: Obtained by a combination of a polysiloxane having an epoxy group and silanol group having a specific structure and a repeating unit and excellent durability such as heat resistance and ultraviolet resistance, an organic compound having an epoxy group, and a curing agent for epoxy resin. The composition for optical semiconductor sealing obtained is cured by heating at 100 to 180 ° C. for 3 to 13 hours to obtain a cured product. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103987657-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013133430-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5472543-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012124343-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9972757-B2 |
| priorityDate |
2009-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |