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filingDate 2009-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011104634-A
titleOfInvention Solder powder manufacturing method
abstract There is provided a method for producing solder powder capable of efficiently obtaining solder powder having an average particle size of 0.05 μm or more and less than 3 μm with a stable yield. In a container, a solid or liquid metal, a non-aqueous solvent, and a pulverizing ball having a diameter of 0.05 mm to 5 mm are placed to obtain a mixture, and the mixture is melted at -5 ° C. The step of heating to the melting point of the metal + 20 ° C. and stirring, the step of separating the balls for grinding from the mixture after stirring to obtain a mixture of solder powder and a non-aqueous solvent, the solder powder and the non-aqueous solvent There is provided a method for producing solder powder, which comprises a step of solid-liquid separation of the mixture to obtain solder powder. [Selection figure] None
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