http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011100908-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
filingDate 2009-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa32363982c69377dd74dfdb5a4bb10e
publicationDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011100908-A
titleOfInvention Printed wiring board and semiconductor device
abstract The present invention provides a method for manufacturing a printed wiring board that can suppress warping of the printed wiring board and improve the yield of mounting semiconductor elements and the reliability of semiconductor packages. A printed wiring board manufacturing method for forming a through hole in a core substrate of a printed wiring board, the step of forming a through hole by irradiating a laser from one side of the core substrate; and the core Irradiating a laser from the other surface side of the substrate to form another through-hole, wherein the number of through holes formed by irradiating the laser from the one surface side of the core substrate is A, the core substrate When the number of through holes formed by irradiating a laser from the other surface side of B is B, the ratio of the number of through holes A to the number of through holes B in the printed wiring board is 0.2 or more and 5.0. A printed wiring board characterized by the following. [Selection] Figure 1
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priorityDate 2009-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.