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filingDate 2009-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011096727-A
titleOfInvention Manufacturing method of semiconductor device
abstract In a semiconductor device having a MISFET that requires a relatively large current driving force at a low voltage and a MISFET that requires a high breakdown voltage for high-speed operation, each element is improved while improving its element characteristics. Manufactured in a simplified process. When forming side walls A and B on the side walls of a gate electrode 4 of a low breakdown voltage MISFET and a memory gate electrode 8 of a MONOS memory, an oxidation that can be deposited at a low temperature without using a dedicated mask. A film is formed on the silicon substrate 1 on which a photoresist film is formed, and side walls A and B having different widths are formed on the side walls of the gate electrode 4 and the memory gate electrode 8, respectively. [Selection] Figure 7
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