| abstract |
When manufacturing a light-emitting device by flip-chip mounting a light-emitting element such as a light-emitting diode on a wiring board using an anisotropic conductive adhesive, a light reflection layer that causes an increase in manufacturing cost is used as the light-emitting element. There is provided a light-reflective conductive particle that is not provided and does not cause a difference between the light emission color and the reflected light color of the light-emitting element without lowering the light emission efficiency. Light-reflective conductive particles for anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board are composed of core particles coated with a metal material and refracted on the surface thereof. And a light reflecting layer formed of light reflecting inorganic particles having a rate of 1.52 or more. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, and aluminum oxide particles. [Selection] Figure 1A |