| abstract |
An object of the present invention is to provide an adhesive film that has heat resistance and moisture resistance necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting substrate, and can suppress volatile components during use. It is providing the adhesive composition which can form, its manufacturing method, the adhesive film using the adhesive composition, the board | substrate for semiconductor mounting, and a semiconductor device. The method comprises (a) an epoxy resin, (b) a curing agent, and (c) a polymer compound that is incompatible with the epoxy resin, and (d) a filler and / or (e) as necessary. An adhesive composition containing a curing accelerator; An adhesive composition comprising (a) an epoxy resin and (b) a curing agent and (d) a filler, and then mixing (c) a polymer compound incompatible with the epoxy resin into the mixture. Production method; An adhesive film formed by forming the adhesive composition into a film; A semiconductor mounting substrate comprising the adhesive film on a chip mounting surface of a wiring substrate; and a semiconductor device using the adhesive film or the semiconductor mounting substrate. [Selection figure] None |