http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011082543-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
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filingDate 2010-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_faa6ec06f133f9e698da0ad694d5f856
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publicationDate 2011-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011082543-A
titleOfInvention Manufacturing method of semiconductor device
abstract A highly reliable semiconductor device with high integration, low cost, and high reliability is provided. A substrate including a first region MC and a surrounding second region PC, an insulating film formed on the second region PC, and an electrode formed on the surface of the substrate 1 in the first region MC And a dielectric film formed on the electrode and a counter electrode formed on the dielectric film, and the shape of the side wall of the insulating film includes a portion reflecting the outer peripheral shape of the side wall of the opposing electrode. [Selection] Figure 2
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