http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011082409-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_171750900388cc1eb516511793bdb9e2 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2009-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76ee8a42de9d31c9d732ead7c98c69bf |
| publicationDate | 2011-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2011082409-A |
| titleOfInvention | Semiconductor device and manufacturing method of semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To prevent formation of a compound with a component contained in a photosensitive resin on the surface of a wiring. A semiconductor substrate 11 having connection pads 11 on an upper surface is prepared. Next, an insulating material 41 is formed on the first wiring 33 electrically connected to the connection pad 3 to form a photosensitive resin 45. When the opening 45 a is formed in the photosensitive resin 45, the first wiring 33 is covered with the insulating material 41. Therefore, even if the photosensitive resin 45 is cured in this state, a compound with a component contained in the photosensitive resin 45 is not formed on the surface of the first wiring 33. [Selection] FIG. |
| priorityDate | 2009-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.