| abstract |
An LED lead frame having a reflective film that can maintain a high reflectance for a long period of time and can be formed stably and easily is provided. A substrate 11 made of copper or a copper alloy has a Ni plating film 12a having a thickness of 0.4 μm or more, an Ag plating film 12b having a thickness of 0.2 μm or more, and Ge: 0.06 to 0.5 at%. Bi: LED lead frame 10 in which an Ag alloy film 13 having a film thickness of 20 to 500 nm containing 0.02 to 0.2 at% is laminated, and a Ni plating film 12 a is formed on the surface of the substrate 11. This prevents Cu from being thermally diffused and discolored from the substrate 11 to the surface. Further, the Ag alloy film 13 is formed by a sputtering method so that Ge and Bi are concentrated on the surface to impart heat resistance, halogenation resistance, and sulfidation resistance. By forming a large Ag plating film 12b as a base, the crystal grain size of the Ag alloy film 13 is increased, and aggregation of Ag due to heat is suppressed. [Selection] Figure 1 |