http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011068923-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-04
filingDate 2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599631ad2f14dcd02f2772d66063f1fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b305b51116412fe8d16376edb788029c
publicationDate 2011-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011068923-A
titleOfInvention Deposition method
abstract There is provided a film forming method capable of obtaining a film at low cost by a simple method without using a mask or a resist film when forming a film on a substrate. A film forming method of the present invention includes a step of forming a liquid repellent film 2 on a surface 1a of a substrate 1, and a predetermined pattern having low adhesion energy and a predetermined pattern on the liquid repellent film 2 by an ink jet method. A step of forming the resin layer 5 and a deposition material 6 deposited on the liquid repellent film 2 including the resin layer 5, and the deposition material 6 is applied to the resin layer 5 except for a region having a low adhesion energy and a predetermined pattern. And a step of forming the aggregated vapor deposition material 6 as a film 7 on the liquid repellent film 2. [Selection] Figure 1
priorityDate 2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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