| abstract |
(A) a polysiloxane containing a phenyl group and an epoxy group which may have a substituent, and (B) a curing agent for an epoxy resin, the phenyl group optionally having a substituent Content is 8-30 mass% with respect to said (A) polysiloxane, The light-emitting element produced using the composition for optical semiconductor sealing characterized by the above-mentioned. The composition for encapsulating an optical semiconductor according to the present invention can form a cured product having improved crack resistance, adhesion, and resistance to discoloration of electrodes without impairing heat resistance and light resistance. [Selection figure] None |