| abstract |
The present invention provides an underfill material composition for an optical semiconductor device that does not affect the warping behavior during reflow as a cured product, and is excellent in heat resistance, light resistance, and adhesion to gold bumps. A branched organopolysiloxane (1) (CH 3 ) a Si (OR 1 ) b (OH) c O (4- ) represented by the following average composition formula (1) and having a weight average molecular weight of 500 to 20000: abc) / 2 (wherein R 1 is an organic group having 1 to 4 carbon atoms, and a, b and c are 0.8 ≦ a ≦ 1.5, 0 ≦ b ≦ 0.3, 0.001) ≦ c ≦ 0.5 and 0.801 ≦ a + b + c <2), inorganic filler, condensation catalyst, organopolysiloxane having a linear diorganopolysiloxane residue (silicon atom of the residue) Independently includes a hydroxyl group, a group having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group, and an allyl group, and 5 to 50 repeating units), and a silane coupling agent. Underfill material composition. [Selection figure] None |