| abstract |
The present invention provides a package structure of a light emitting diode capable of enhancing a heat radiation effect and improving light emission efficiency. A substrate unit includes a substrate body, and an upper surface of the substrate body includes a first conductive solder pad, a second conductive solder pad, and a chip mounting solder pad. The alloy unit includes a nickel palladium alloy formed on the chip-mounted solder pad. The light emitting unit comprises a light emitting diode chip positioned on the nickel palladium alloy of the alloy unit by already solidified tin balls or tin paste. The conductive unit includes at least two conductive wires, the light emitting diode chip is electrically connected between the first conductive solder pad and the second conductive solder pad by the at least two conductive wires, and the package unit is mounted on the substrate body. A translucent package colloid covering the light emitting unit and the conductive unit is formed by molding on the surface. [Selection] Figure 1 |