| abstract |
The present invention provides a polishing liquid composition that can reduce residues on a wafer surface and has good wettability on the wafer surface, and a method for manufacturing a semiconductor substrate using the polishing liquid composition. A polishing material comprising an abrasive, hydroxyethyl cellulose, and a basic compound, wherein the hydroxyethyl cellulose is hydroxyethyl cellulose prepared by hydrolyzing hydroxyethyl cellulose having a weight average molecular weight of 300,000 to 3,000,000. Liquid composition. The weight average molecular weight of hydroxyethyl cellulose prepared by hydrolysis is preferably 10,000 to 1.8 million. The weight ratio of abrasive to hydroxyethyl cellulose in the polishing composition (weight% of abrasive / wt% of hydroxyethyl cellulose) is preferably 10 to 10,000. [Selection figure] None |